PRODUCTS & SOLUTIONS

Explore our comprehensive range of world-leading fault localization microscopes, cutting-edge analysis techniques, and precision accessories designed for semiconductor design-debug, yield improvement, and failure analysis.

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🔧 Configurations

Products World-Leading Fault Localization Systems

SEMICAPS 1100

Standalone System

SEMICAPS 1100

Upright Analytical Microscope System

A standalone lab based upright analytical microscope system for comprehensive semiconductor analysis with ultra-stable performance.

Key Features

Backside and frontside analysis capability
Ultra-stable system compatible for probing FIB pads
High resolution stage with 0.5 μm repeatability
ARSIL option for 3nm node probing
CAD interface compatibility

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SEMICAPS 3000

Tester Dockable

SEMICAPS 3000

Inverted Tester Dockable System

An inverted microscope system that is tester dockable, easily moved from tester to tester with custom docking for all ATE platforms.

Key Features

Backside analysis with ATE platform docking
Easily moved between different testers
Custom docking for all ATE platforms
High resolution stage with 0.5 μm repeatability
Thermal management solutions compatible

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SEMICAPS 4000

Dual Configuration

SEMICAPS 4000

Analytical & Tester Dockable System

An inverted system that is both analytical and tester dockable, featuring 300mm wafer stage with auto-lock compatibility.

Key Features

Analytical or ATE docked configuration
300mm wafer stage with auto-lock
Compatible with probe cards and manipulators
Docks easily to tester or probe station
ARSIL option for 3nm node probing

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SEMICAPS 5000

Full Analytical

SEMICAPS 5000

Direct Tester-Docked Wafer Prober

A full analytical direct tester-docked wafer prober system that eliminates the need for sorting, dicing and repackaging of wafers.

Key Features

Eliminates wafer sorting, dicing, and repackaging
Analyze at full tester speeds up to 8 GHz
Land more than 10,000 pins with standard probe card
ARSIL option compatible with full thickness wafer
Complete LTP, SOM, PEM, and THM integration

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🔬 Techniques

Solutions Advanced Analysis Techniques

LTP Technology

Waveform Analysis

Laser Timing Probe (LTP)

Non-Contact Waveform Measurement

Revolutionary instrument that measures waveforms at any selected point inside a semiconductor device without physical contact, using precision laser technology.

Key Capabilities

Non-invasive backside waveform detection
FFT Frequency Mapping for signal path tracing
Bandwidth up to 12 GHz
Test loop lengths up to 1000 ms
Rise time measurement < 40 ps

Resolution Centric & Aplanatic RSILs

Bandwidth Up to 12 GHz

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PEM Technology

Passive Detection

Photon Emission Microscopy

Highly Sensitive Fault Localization

Highly sensitive passive fault localization system for integrated circuit defects using panchromatic imaging and spectroscopy techniques.

Key Capabilities

Multi detectors (InGaAs, Extended InGaAs)
Emissions spectrum coverage to 2100 nm
Dedicated macro lens for high sensitivity
Modular platform - field upgradeable
Refractive Solid Immersion lens options

Detection Range Visible to 2100 nm

Array Sizes 1k x 1k, 640 x 512, 320 x 256

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SOM Technology

Active Localization

Scanning Optical Microscopy

Multi-Laser Active Defect Localization

Multi-laser scanning optical microscope system for active localization of integrated circuit defects using static power alteration and dynamic techniques.

Key Capabilities

Multiple laser options (1340nm, 1320nm, 1064nm)
Static techniques: TIVA, OBIRCH
Dynamic techniques: LADA, SDL
High power delivery >30 mW at DUT
Laser pulsing: 10x sensitivity improvement

Scan Array Up to 2k x 2k

Power Delivery >30 mW at DUT

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THM Technology

Thermal Analysis

Thermal Microscopy

Thermographic Hotspot Detection

Thermographic capturing system that pinpoints MWIR emissions within semiconductor devices to locate thermal hotspots from various defects.

Key Capabilities

High resolution stirling-cooled MCT detector
3 positions angled objective turret
Navigation CCD for background overlay
Room temperature imaging capability
Lock-in thermography option

Configuration Analytical or Tester-Docked

Detection MWIR Emissions

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⚙️ Accessories

Accessories Precision Enhancement Solutions

Auricool

Thermal Management

Auricool

Advanced Cooling System

A patented cooling system for dynamic laser technique and laser waveform probing, capable of handling >200W heat flux with proprietary thermal interface.

Key Features

Patented design for active DUT heat removal
Handles up to >200W of heat flux
Proprietary thermal interface with closed loop chiller
Compatible with SIL and air gap lenses
Accommodates die-side components with flexible pins

Heat Capacity >200W Heat Flux

Patent US 9,917,034

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ARSIL Aplanatic Solid Immersion Lens Image 1

ARSIL

Precision Optics

ARSIL

Aplanatic Solid Immersion Lens

An aplanatic solid immersion lens with resolution better than 100nm, providing the smallest laser spot size for optimal signal return with lowest noise and cross-talk.

Key Features

Smallest laser spot size on DUT
3.3 NA (<150nm resolution pitch)
Best sensitivity for high speed/power devices
SIL option for full backside thickness (750-775μm)
Used in 3nm and 5nm technology nodes

Resolution <100nm

NA 3.3 (<150nm pitch)

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Liquid Crystal

Hotspot Detection

Liquid Crystal

Cost-Effective Hotspot Location

Cost-effective method to locate hot spots using liquid crystal analysis, providing precise identification of heat generation points down to 20mW through polarized light microscopy.

Key Features

Precise heat generation point identification
Detection sensitivity down to 20mW
Non-destructive analysis method
Compatible with probe station microscopes
Uses polarized light for visualization

Sensitivity Down to 20mW

Method Non-Destructive

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