Products – Configurations

SEMICAPS 1100

A standalone lab based upright analytical microscope system

  • For backside and frontside analysis of wafers, wafer parts and packaged devices
  • Ultra-stable system compatible for probing FIB pads
  • Compatible with third-party probe stations, probe cards and manipulators
  • High resolution stage with 0.5 μm repeatability
  • Aplanatic Refractive Solid Immersion Lens (ARSIL) option, currently probing 3nm nodes
  • CAD interface option
  • Techniques include a combination of:
    • Laser Timing Probe (LTP)
    • Scanning Optical Microscopy (SOM) with best sensitivity
      • static: TIVA, OBIRCH
      • dynamic: LADA, SDL
  • Photon Emission Microscopy (PEM) with various options for
      • InGaAs or Si-CCD camera
      • Thermal Microscopy (THM) with InSb camera
For backside and frontside analysis of wafers, wafer parts and packaged devices
Brochure

SEMICAPS 3000

An inverted microscope system that is a tester dockable

  • For backside analysis of wafers, wafer parts and packaged devices. Able to dock with ATE platforms
  • Easily moved from Tester to Tester
  • Custom docking for all ATE platforms
  • High resolution stage with 0.5 μm repeatability
  • Aplanatic Refractive Solid Immersion Lens (ARSIL) option, currently probing at 3nm nodes
  • CAD Interface option
  • Compatible with Thermal Management Solutions
  • Techniques include a combination of:
    •  Laser Timing Probe (LTP)
    • Scanning Optical Microscopy (SOM) with best sensitivity
      • static: TIVA, OBIRCH
      • dynamic: LADA, SDL
    • Photon Emission Microscopy (PEM) with various option for
      • InGaAs or Si-CCD Camera
      • Thermal Microscopy (THM) with InSb camera
For backside and frontside analysis of wafers, wafer parts and packaged devices. Able to dock with all ATE platforms
Brochure

SEMICAPS 4000

An inverted system that is both analytical and tester dockable

  • Analytical or ATE docked configuration
  • 300 mm wafer stage including auto-lock compatible with Probe Cards and manipulators
  • Docks easily to Tester or Probe Station
  • High resolution stage with 0.5 μm repeatability
  • Aplanatic Refractive Solid Immersion Lens (ARSIL) option, currently probing at 3nm nodes
  • CAD interface option
  • Techniques include a combination of:
    • Laser Timing Probe (LTP)
    • Scanning Optical Microscopy (SOM) with best sensitivity
      • static: TIVA, OBIRCH
      • dynamic: LADA, SDL
    • Photon Emission Microscopy (PEM) with various options for the InGaAs or Si-CCD camera
    • Thermal Microscopy (THM) with InSb camera
Analytical or ATE docked configuration
Brochure

SEMICAPS 5000

A full analytical direct tester-docked wafer prober system

  • Wafer analysis using a combination of Laser Timing Probe (LTP), Scanning Optical Microscope (SOM) and Photon Emission Microscope (PEM)
  • Eliminate the need for sorting, dicing and repackaging of the wafer 
  • Able to analyze at full tester speeds of up to 8 GHz
  • Land more than 10,000 pins using a standard Production Probe Card
  • ARSIL option: compatible with full thickness, unthinned wafer
Wafer analysis using a combination of Laser Timing Probe (LTP), Scanning Optical Microscope (SOM), Photon Emission Microscope (PEM) and Thermal Microscopy (THM)
Brochure