Product – Techniques

Laser Timing Probe (LTP)

An instrument which allows the waveform at a selected point inside a semiconductor device or IC to be measured without a physical probe, by using a laser

  • Non-invasive backside detection of waveforms/logicwithin a die using a CW laser
  • FFT Frequency Mapping to quickly trace signal paths inside a die
  • Best-in-class
    • Resolution with Centric and Aplanatic RSILs
    • Bandwidth up to 12 GHz
    • Test loop lengths up to 1000 ms
    • Measure rise times < 40 ps
  • Optional:
    • SOM with 1064 nm and 1340 nm lasers
    • PEM with ultra low-noise InGaAs camera (LN2 or TE-cooled)
  • Device Thermal Control
The SEMICAPS Laser Timing Probe (LTP) uses a laser to contactlessly probe for waveforms in the internal gates of an integrated circuit (IC). The design-debug technique enables the engineer to locate points within the die where the waveform begin to become defective. The equipment can also measure waveform timings and delays to ensure that these are within the IC design specifications.

Photon Emission Microscopy

A highly sensitive passive fault localization system for the localization of integrated circuit defects using a panchromatic imaging and spectroscopy

  • Uses a highly automated hardware and software system which can be switched to a manual mode when desired
  • Stage movements is fully controlled from the computer console via the X, Y and Z buttons on the user interface screen or by joystick control
  • Detectors and optics are automatically moved into and out of position from the optical path depending on the imaging mode (Live or Capture) chosen
  • On selecting Backside Imaging, the NIR filter is automatically positioned into the optical path
  • a user-friendly Window-based system which supports functions like real-time frontside and backside imaging, image acquisition and overlay, and other processes to simplify FA operations
  • Allows live stage navigation using a user-interface window with its dual camera system
  • DUT can be continously monitored and inspected without opening the light-tight enclosure
  • Coordinate registration system enables users to interface with almost any third party CAD software (eg. Knights)
  • Par center and par focus are software corrected so that the image center and focus do not change with different objectives
  • Extensive tools like image processing, annotation and customized data reports are available in the software
  • An automated removable NIR filter, optimized optics and light source, SEMICAPS PEM series offer both frontside and backside imaging as standard features in one integrated system
Main applications for the Photon Emission Microscope is to locate failures like leaky junctions, contact spiking (due to ESD), latch-up, oxide breakdown, and other current leakage phenomena that produce light emissions.

Scanning Optical Microscopy

A multi-laser scanning optical microscope system for the active localization of integrated circuit defects by using static power alteration and dynamic tester-based techniques

  • Lasers option – 1340 nm/ 1320 nm / 1064 nm with laser scan array size up to 2k x 2k
  • Multiple techniques available
  • static: TIVA, OBIRCH
  • dynamic: LADA, SDL
  • High power delivery 30 mW at  DUT for all objectives including 100x
  • Lock-in and Laser Pulsing technique: 10x improvement in sentivity
  • Pixed by pixel flexible scanning mode with user defined multiple – AOI
  • Module platform, field-upgradeable to LTP
  • Flexible and customizable
  • Centric and Aplanatic Refractive Solid Immersion Lens (RSIL) options
  • Option to mount PEM cameras (InGaAs, TE-Cooled, LN2)
The instrument is an integrated compucentric system designed for maximum ease of use and flexibility. It is optimized for high laser power delivery, sensitivity and spatial resolution

Thermal Microscopy

Thermographic capturing system can pinpoint MWIR emissions within a semiconductor device. It can locates thermal hotspots arising from a variety of defects. It can be integrated into any of the SEMICAPS housing configuration and installed together with the Laser Scanning Microscope (SOM) and a CCD navigation camera on the same platform

  • Analytical or tester-docked, upright or inverted configurations
  • High resolution stirling-cooled MCT detector
  • 3 positions angled objective turret
  • Navigation CCD for high resolution background overlay
  • Automated detector parcentering
  • Room temperature imaging
  • Incorporate into combine microscope
  • Par-focus
  • Large format for better FOV
  • LN2 option available
  • Hi-resolution option available
  • Large format option available
  • Lock-in thermography option
  • Montage option
The THM may be used to locate a range of defects in a semiconductor deivce, like short circuits, oxide breakdowns, device latch-up and leakage currents
Lock-in Thermography improves localization by minimizing hotspot dilation. It can also use phase delay information to locate hotspot in a stacked IC
It could also be used to perform temperature mappping