Combining refractive solid immersion lens and pulsed laser induced techniques for effective defect localization on microprocessors
A.C.T. Quah; S.H. Goh; V.K. Ravikumar; S.L. Phoa; V. Narang; J.M. Chin; C.M. Chua; J.C.H. Phang
Proceedings, 34th International Symposium for Testing and Failure Analysis
ISTFA 2008, 2-6 November 2008, Portland, OR, USA, pages 402-406
Usage of Laser Timing Probe for Sensing of Programmed Charges in EEPROM Devices
L. Bidani; O. Baharav; M. Sinvani; Z. Zalevsky
IEEE Transactions on Device and Materials Reliability
Volume 14, Issue 1, March 2014, pages 304 – 310
Soft defect localization (SDL) in integrated circuits using laser scanning microscopy
M.R. Bruce; V.J. Bruce; D.H. Eppes; J. Wilcox; E.I. Cole; P. Tangyunyong; C.F. Hawkins; R. Ring
16th Annual Meeting of the IEEE Lasers and Electro-Optics Society, 2003
LEOS 2003, 27-28 October 2003, Tucson, AZ, USA, pages 662-663 Vol 2
A Novel Method to Realize Soft Defect Localization Techniques without a Synchronization Signal for Failure Analysis
C.L Wu; L. Zhai; M. Motohiko; J. Liu; H. Ma; J. Liu
Proceedings, 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA 2009, 6-10 July 2009, Suzhou, Jiangsu, China, pages 237-240
Detection of DR violations in ASIC components using photon emission techniques
E. Redmard; D. Hanan; A. Shevachman
Microelectronics Reliability
Volume 52, Issues 9–10, September–October 2012, pages 2054-2057
A review of laser induced techniques for microelectronic failure analysis
J.C.H. Phang; D.S.H. Chan; M. Palaniappan; J.M. Chin; B. Davis; M. Bruce; J. Wilcox; G. Gilfeather; C.M. Chua; L.S. Koh; H.Y. Ng; S.H. Tan
Proceedings, 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA 2004, 5-8 July 2004, Taipei, Taiwan, pages 255-261
Enhanced detection sensitivity with pulsed laser digital signal integration algorithm
A.C.T Quah; J.C.H. Phang; L.S. Koh; S.H Tan; C.M.Chua
Proceedings, 32nd International Symposium for Testing and Failure Analysis 2006
ISTFA 2006, November 2006, Austin, TX, USA, pages 234-238
Imaging using cylindrical vector beams in a high-numerical-aperture microscopy system
R. Chen; K. Agarwal; Colin J.R. Sheppard; and X.D. Chen
Optics Letters
Volume 38, Issue 16, (August 2013), pages 3111-3114
A complete and computationally efficient numerical model of aplanatic solid immersion lens scanning microscope
R. Chen; K. Agarwal; C.J.R. Sheppard; J.C.H. Phang; and X. Chen
Optics Express (2013)
Volume 21, no. 12, 2013, pages 14316-14330
A Demonstration on the Effectiveness of Wafer-level Thermal Microscopy as A Complementary Tool to Photon Emission Microscopy Using MBIST Failure Debug
B.L. Yeoh; S.H. Goh; M.H. Thor; H. Hao; A. Tan; Y.H. Chan; Z. Lin; S.P. Neo; J. Lam; C.M. Chua; and S.H. Tan
Proceedings, 25th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA 2018, 16-19 July 2018, Singapore, pages 1-5?
On die logic analysis through the backside
M.R. Bruce; L.K. Ross; C.M. Chua
Proceedings, 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA 2014, 30 June – 4 July 2014, Singapore, pages 366-369
DC-Coupled Laser Induced Detection System for Fault Localization in Microelectronic Failure Analysis
A.C.T. Quah; L.S. Koh; C.M. Chua; M. Palaniappan; J.M. Chin; J.C.H. Phang
Proceedings, 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA 2006, 3-7 July 2006, Singapore, pages 327-332
Design considerations for refractive solid immersion lens: Application to subsurface integrated circuit fault localization using laser induced techniques
S.H. Goh; C.J.R. Sheppard; A.C.T. Quah; C.M. Chua; L.S. Koh; and J.C.H. Phang
Review of Scientific Instruments, Jan 2009
Volume 80, Issue 1, 21 January 2009, page 013073
Effectiveness of frequency mapping on 28 nm device broken scan chain failures
S.H. Goh; Y. Pan; G.F. You; Y.H. Chan; H. Ran; T. Herrman; T. Heller; V.S. Lim; Z.H. Mai; J. Lam; and C.M. Chua
Review of Scientific Instruments, Feb 2012
Volume 83, Issue 2, 6 February 2012 page 023702
VLSI for Space Applications: Single Event Effect Investigation and Optical Analysis on an Integrated Laser Platform
S. Chef; C.T. Chua; Y.W. Siah; P. Perdu; S.H. Tan; L.S. Koh; and C.L.Gan
Proceedings, 43rd International Symposium for Testing and Failure Analysis
ISTFA 2017, 5-9 November 2017, Pasadena, CA, USA, pages 621-630
Switching and filamentary conduction in non-volatile organic memories
M. Cölle; M. Büchel; and D.M. de Leeuw
Organic Electronics 2006
Volume 7, Issue 5, October 2006, pages 305-312
Non-Invasive Recognition of Poorly Resolved Integrated Circuit Elements
E. Matlin; M. Agrawal; D.Stoker
IEEE Transactions on Information Forensics and Security
Volume 9, Issue 3, March 2014, pages 354-363
Negative backside thermoreflectance modulation of microscale metal interconnects
J.K.J. Teo; C.M. Chua; L.S. Koh; J.C.H. Phang
Electronics Letters, 2011
Volume 47, Issue 14, 7 July 2011, pages 821-822
Scanning Optical Microscopy Application in Micron® Memory Devices
W.Y. Yuan; E. Poh; D. Lam
Proceedings, 31st International Symposium for Testing and Failure Analysis
ISTFA 2005, 6-10 November 2005, San Jose, CA, USA, pages 90-94
Crossing the Resolution Limit in Near-Infrared Imaging of Silicon Chips: Targeting 10-nm Node Technology
K. Agarwal; R. Chen; L.S. Koh; C.J.R. Sheppard; and X. Chen
Physical Review X, 2015
Volume 5, Issue 2, May 2015, page 021014
Tester-Driven Dynamic Laser Stimulation for Hard Functional Failure
S.H. Goh; Y.H. Chan; F. Zheng; H. Tan; J.W. Ting; R. Chen; Z.H. Mai; J. Lam; L.C. Hsia; C.M. Chua; J.C.H. Phang
Proceedings, 36th International Symposium for Testing and Failure Analysis, 2010
ISTFA 2010, 14-18 November 2010, Addison, Dallas, TX, USA, pages 332-337
A review of near infrared photon emission microscopy and spectroscopy
J.C.H. Phang; D.S.H. Chan; S.L. Tan; W.B. Len; K.H. Yim; L.S. Koh; C.M. Chua; L.J. Balk
Proceedings, 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA 2005, 27 June – 1 July 2005, Singapore, pages 275-281
New signal detection methods for thermal beam induced phenomenon
M. Palaniappan; J.M. Chin; B. Davis; M. Bruce; J. Wilcox; C.M. Chua; L.S. Koh; H.Y. Ng; S.H. Tan; G. Gilfeather; J.C.H. Phang
Proceedings, 27th International Symposium for Testing and Failure Analysis
ISTFA 2001, 11-15 November 2001, Santa Clara, CA, USA, pages 171-177
Pattern search automation for combinational logic analysis
R.V. Krishnan; Y.X. Seah; G. Lim; A. Tan; W. Lua; G. Ranganathan; A. Phoa; and C.M. Chua
Proceedings, 44th International Symposium for Testing and Failure Analysis
ISTFA 2018, 28 October – 1 November 2018, Phoenix, AZ, USA, pages 86-92
Laser modulation mapping on an unmodified laser scanning microscope
F. Zachariasse; G. Boon; G. Faggion; and K.Sarault
Microelectronics Reliability, 2010
Volume 50, Issues 9–11, September–November 2010, Pages 1417-1421
Localization of Cu/low-k interconnect reliability defects by pulsed laser induced technique
T.L. Tan; A.C.T. Quah; C.L. Gan; J.C.H. Phang; C.M. Chua; C.M. Ng; and A. Du
Proceedings, 33rd International Symposium for Testing and Failure Analysis
ISTFA 2007, 4-8 November 2007, San Jose, CA, USA, pages 156-160
Effect of Refractive Solid Immersion Lens parameters on the enhancement of laser induced fault localization techniques
S.H. Goh; A.C.T. Quah; C.J.R. Sheppard; C.M. Chua; L.S. Koh; J.C.H. Phang
Proceedings, 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA 2008, 7-11 July 2008, Singapore, pages 1-6
Determination of Intrinsic Spectra from Frontside & Backside Photon Emission Spectroscopy
S.L. Tan; K.H. Toh; D.S.H. Chan; J.C.H. Phang; C.M. Chua; L.S. Koh
Proceedings, 45th IEEE International Reliability Physics Symposium
IRPS 2007, 15-19 April 2007, Phoenix, AZ, USA
Backside deprocessing technique & its novel fault isolation application
T.T. Eng; H.E. Lwin; P. Muthu; J.M. Chin
Proceedings, 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA 2005, 27 June – 1 July 2005, Singapore, pages 110-113
An effective broken scan chain diagnosis flow combining software and hardware solutions for systematic failures
S.H. Goh; G.F. You; B.L. Yeoh; Y.H. Chan; C.C. Tey; C.P. Yap; T.Y. Lim; T. Fei; T. Herrmann; H.W. Ho; R. He
19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA 2012, 2-6 July 2012, Singapore, pages 1-5
N-channel metal-oxide-semiconductor characterization with static and dynamic backside laser reflectance modulation techniques
J.K.J. Teo; C.M. Chua; L.S. Koh; and J.C.H. Phang
Applied Physics Letters, 2011
Volume 99, number 9, September 2011, page 094105
Gate oxide integrity failure caused by molybdenum contamination introduced in the ion implantation
D. Gui; Y.H. Huang; G.B. Ang; Z.X. Xing; Z.Q. Mo; Y.N. Hua; J. Teong
Proceedings, 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA 2008, 7-11 July 2008, Singapore, pages 1-4
Descrambling of Embedded SRAM Using a Laser Probe
S. Chef; C.T. Chua; J.Y. Tay; Y.W. Siah; S. Bhasin; J. Breier; C.L. Gan
Proceedings, 25th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA 2018, 16-19 July 2018, Singapore, pages 1-6
A non destructive scan diagnosis based fault isolation technique verification method using infrared laser stimulation on wafer level
G.F. You; S.H. Goh; B.L. Yeoh; H. Hu; N.L. Chung; T. Fei; C. P. Yap; T. Y. Lim; J. Lam
Proceedings, 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA 2013, 15-19 July 2013, Suzhou, China, pages 35-37
Laser beam induced dielectric cracks in VLSI devices
A. Maury; J. Schaller; C.L. Goh; I.I. Yaacob; C.M. Chua; S.H. Tan; A. Maznev; K. Gomez
Proceedings, 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA 2005, 27 June – 1 July 2005, Singapore, pages 9-13
Failure Analysis of Damages on Advanced Technologies Induced by Picosecond Pulsed Laser During Space Radiation SEE Testing
C.T. Chua; Q. Liu; S. Chef; K. Sanchez; P. Perdu; C.L. Gan
Proceedings, 25th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA 2018, 16-19 July 2018, Singapore, pages 1-6
Effects of forward gate bias stressing on the leakage current of AlGaN/GaN high electron mobility transistors
Y. Gao; W.A. Sasangka; C.V. Thompson; C.L. Gan
Microelectronics Reliability, 2019
23 September 2019, article 113432.
Failure Analysis Methodology on Resistive Open Defects
A.C.T. Quah; G.B. Ang; D. Nagalingam; C.Q. Chen; H.P. Ng; S.P. Neo; J. Lam; Z.H. Mai
Proceedings, 40th International Symposium for Testing and Failure Analysis
ISTFA 2014, 9–13 November 2014, Houston, TX, USA, pages 345-349
Characterization of MOS Transistors Using Dynamic Backside Reflectance Modulation Technique
J.K.J. Teo; C.M. Chua; L.S. Koh; J.C.H. Phang
Proceedings, 37th International Symposium for Testing and Failure Analysis
ISTFA 2011, 13-17 November 2011, San Jose, CA, USA, pages 170-175
Wafer-level fault isolation approach to debug integrated circuits JTAG failures
S.H. Goh; G.F. You; B.L. Yeoh; H. Hao; N.L. Chung; C.P. Yap; and J. Lam
Proceedings, 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA 2014, 30 June – 4 July 2014, Singapore, pages 30-34
Static fault localization of subtle metallization defects using near infrared photon emission microscopy
A.C.T. Quah; D. Nagalingam; S. Moon; E. Susanto; G.B. Ang; S.P. Neo; J.C. Lam; Z.H. Mai
Microelectronics Reliability, 2017
Volume 73, June 2017, Pages 76-91
Combined Thermography and Luminescence Imaging to Characterize the Spatial Performance of Multicrystalline Si Wafer Solar Cells
M.P. Peloso; Lei Meng; C.S. Bhatia
IEEE Journal of Photovoltaics
Volume 5, Issue 1, January 2015, pp. 102-111
Complete modeling of subsurface microscopy system based on aplanatic solid immersion lens
R. Chen; K. Agarwal; Y.Z Zhong;, C. J. R. Sheppard; J. C. H. Phang; and X.D Chen
Journal of the Optical Society of America A, (2012)
Vol. 29, Issue 11, November 2012, pages 2350-2359
Applications of scanning near-field photon emission microscopy
D.V. Isakov; B.W.M. Tan; J.C.H. Phang; Y.C. Yeo; A.A.B. Tio; Y. Zhang; T. Geinzer; L.J. Balk
Proceedings, 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA 2009, 6-10 July 2009, Suzhou, Jiangsu, China, pages 631-634
Through silicon in-circuit logic analysis for localizing logic pattern failures
M.R. Bruce; L.K. Ross; C. Scholz; L. Joshi; Vrajesh Dave; C.M. Chua
Microelectronics Reliability, 2012
Volume 52, Issues 9-10, September – October 2012, pages 2043-2049.
Laser timing probe with frequency mapping for locating signal maxima
L.S. Koh; H. Marks; L.K. Ross; C.M. Chua; J.C.H. Phang
Conference Proceedings, 35th International Symposium for Testing and Failure Analysis
ISTFA 2009, 15-19 November 2009, San Jose, CA, USA, pages 33-37
Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect
S.P. Neo; A.C.T. Quah; G.B. Ang; D. Nagalingam; H.H. Ma; S.L. Ting; C.W. Soo; C.Q. Chen; Z.H. Mai; and J.C. Lam
Microelectronics Reliability, 2017
Volumes 76–77, September 2017, Pages 255-260
Static fault localization on Memory failures using Photon Emission Microscopy
N. Dayanand; A.C.T. Quah; C.Q. Chen; G.B. Ang; S. Moon; H.P. Ng; Z.H. Mai; and J. Lam
Proceedings, 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA 2015, 29 June – 2 July 2015, Hsinchu, Taiwan, pages 322-326
Characterization of 1122nm Laser for Laser Based Fault Isolation Applications
V. Somasundaram, Y.X. Seah, A. Phoa, W. Lua, C.M. Chua, and V.K. Ravikumar
Proceedings, 26th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA 2019, 2-5 July 2019, Hangzhou, China, pages 1-4
A study of clustering for the enhancement of image resolution in dynamic photon emission
S. Chef, C.T. Chua, and C.L. Gan
Proceedings, 45th International Symposium for Testing and Failure Analysis
ISTFA 2019, 10-14 November 2019, Portland, OR, USA, pages 68-78
