Singapore – 1 July, 2014 – SEMICAPS Pte Ltd hosted and sponsored a half-day Failure Analysis (FA) Technical Forum at Suntec Convention and Exhibition Centre, Singapore. Attendance was by invitation only.

SEMICAPS aimed to highlight the why and the how of injecting new methodologies and advanced analysis tools into the FA, yield analysis and design-debug workflow. Our guest speakers spoke from their experiences of how enablement of these technologies have given manufacturers a significant advantage to tackle the challenges faced from complex designs and analysis in a time sensitive market.

The forum had four invited guest speakers including Dr Jeffrey Lam, Vice President, GLOBALFOUNDRIES Singapore; Mr Tai Ting Pu, Business and Marketing Development Manager, Mentor Graphics; Dr. Mike Bruce, co-inventor of PICA, RIL, SDL, and Dr. Goh Szu Huat, Manager of Product Diagnostic Solutions, GLOBALFOUNDRIES Singapore. A range of important industry topics were covered. These include: the shift of the value of semiconductor devices from manufacturing into design; advance design-for-test and diagnosis; automatic on-die logic analysis using the Laser Timing Probe; and more efficient wafer level fault isolation and yield engineering. The forum was chaired by Dr. David Tan, Business Development Director, SEMICAPS.