Product – Accessories

Auricool

A cooling system for dynamic laser technique & laser waveform probing

  • Patented design to remove heat from active DUT during analysis. US Patent No.: US 9,917,034
  • Proprietary thermal interface and heat extraction with closed loop chiller
  • Capable of handling up to >200 W of heat flux
  • Option for cooling larger die sizes (Up to 40x40nm and beyond)
  • Compatible with SIL and air gap lenses with optical axis window 
  • Accommodates die-side components with flexible pins
AuriCool is used for the thermal management of devices which generates more than 25 Watts of heat during analysis. It can limit the temperature of such devices to a manageable level
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ARSIL

An aplanatic solid immersion lens with a resolution better than 100 nm

  • The smallest laser spot size on the DUT which gives the best return signal with the lowest noise and lowest cross-talk, used in 3 nm and 5 nm tech node
  • 3.3 NA (<150 nm resolution pitch)
  • Best sensitivity and able to run devices at high speed/power
  • SIL option for full backside thickness (750 – 775 μm)
  • Easy sample prep 50 – 380 μm backside thickness customizable
The ARSIL is used for the laser scanning and probing of advanced semiconductor nodes, especially in design-debug yield analysis
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Liquid Crystal

Cost effective method to locate hot spot

Liquid Crystal Analysis provide an unsurpassed method to precisely identify points where heat is generated, down to 20mW. This non-destructive method enables an analyst to “see hot spots through a probe station microscope with polarized light”.
Many yield and field failures involved excessive current flow, ESD, resistive gate shorts, conductor-to-conductor shorts are examples. Devices with local hot spots are less reliable, leading to early failures.